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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2014-12-08T15:45:39Z Search of optimum bias voltage for oxide patterning on Si using scanning tunneling microscopy in air Tseng, KS; Hsieh, TE; Lo, SC; Lin, HF
國立交通大學 2014-12-08T15:44:38Z Mechanical properties of clay-polyimide (BTDA-ODA) nanocomposites via ODA-modified organoclay Tyan, HL; Wei, KH; Hsieh, TE
國立交通大學 2014-12-08T15:44:08Z Mask films for thermally induced superresolution readout in rewritable phase-change optical disks Lu, YH; Dimitrov, D; Liu, JR; Hsieh, TE; Shieh, HPD
國立交通大學 2014-12-08T15:44:08Z Optical disk mastering using optical superresolution technique Shieh, HPD; Tsai, SY; Peng, YH; Hsieh, TE
國立交通大學 2014-12-08T15:43:48Z Application of A1/PI composite bumps to COG bonding process Jeng, JH; Hsieh, TE
國立交通大學 2014-12-08T15:41:31Z Microwave dielectric properties of glass-ceramic composites for low temperature co-firable ceramics Cheng, CC; Hsieh, TE; Lin, IN
國立交通大學 2014-12-08T15:41:06Z The effect of composition on Ba-Nd-Sm-Ti-O microwave dielectric materials for LTCC application Cheng, CC; Hsieh, TE; Lin, IN
國立交通大學 2014-12-08T15:40:21Z Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers Liang, MW; Hsieh, TE; Chang, SY; Chuang, TH
國立交通大學 2014-12-08T15:39:50Z Effects of composition on low temperature sinterable Ba-Nd-Sm-Ti-O microwave dielectric materials Cheng, CC; Hsieh, TE; Lin, IN
國立交通大學 2014-12-08T15:39:43Z Copper surface protection with a completely enclosed copper structure for a damascene process Wang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW

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