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"hsieh tsung eong"的相关文件
显示项目 131-140 / 165 (共17页) << < 8 9 10 11 12 13 14 15 16 17 > >> 每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:13:06Z |
Effect of UV curing on electrical properties of a UV-Curable co-Polyacrylate/Silica nanocomposite as a transparent encapsulation resin for device packaging
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Wang, Yu-Young; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:13:04Z |
Effect of tertiary amines on yellowing of UV-curable epoxide resins
|
Chiang, Tzu Hsuan; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:12:50Z |
Investigation of electroless Co(W,P) thin film as the diffusion barrier of underbump metallurgy
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Wu, W. C.; Hsieh, Tsung-Eong; Pan, Hung-Chun |
| 國立交通大學 |
2014-12-08T15:12:42Z |
Microstructure and recording mechanism of Bi-Fe-(N) layer for high-density write-once optical disk
|
Mai, Hung-Chuan; Hsieh, Tsung-Eong; Jeng, Shiang-Yao; Chen, Chong-Ming; Wang, Jen-Long |
| 國立交通大學 |
2014-12-08T15:12:25Z |
Effects of interface bonding configuration on photoluminescence of ZnO quantum dots-SiOxNy nanocomposite films
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Peng, Yu-Yun; Hsieh, Tsung-Eong; Hsu, Chia-Hung |
| 國立交通大學 |
2014-12-08T15:12:06Z |
Characterization of write-once blu-ray disk containing Cu-Al/Si recording layer using transmission electron microscopy
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Mai, Hung-Chuan; Hsieh, Tsung-Eong; Jeng, Shiang-Yao |
| 國立交通大學 |
2014-12-08T15:12:03Z |
An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W, P) Layer to Lead-Free SnBi Solder
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Pan, Hung-Chun; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:11:47Z |
Phase-Change Kinetics of Bi-Fe-(N) Layer for High-Speed Write-Once Optical Recording
|
Huang, Sung-Hsiu; Huang, Yu-Jen; Mai, Hung-Chuan; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:11:19Z |
Lifetime improvement of organic light emitting diodes using LiF thin film and UV glue encapsulation
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Huang, Jian-Ji; Su, Yan-Kuin; Chang, Ming-Hua; Hsieh, Tsung-Eong; Huang, Bohr-Ran; Wang, Shun-Hsi; Chen, Wen-Ray; Tsai, Yu-Sheng; Hsieh, Huai-En; Liu, Mark O.; Juang, Fuh-Shyang |
| 國立交通大學 |
2014-12-08T15:10:57Z |
Preparation of epoxy-modified polyethylene by graft extrusion and its applications to polyphenylene sulfide alloys as a compatibilizer
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Chen, Chen-Ming; Hsieh, Tsung-Eong; Liu, Mark O. |
显示项目 131-140 / 165 (共17页) << < 8 9 10 11 12 13 14 15 16 17 > >> 每页显示[10|25|50]项目
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