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机构 日期 题名 作者
國立交通大學 2014-12-08T15:13:06Z Effect of UV curing on electrical properties of a UV-Curable co-Polyacrylate/Silica nanocomposite as a transparent encapsulation resin for device packaging Wang, Yu-Young; Hsieh, Tsung-Eong
國立交通大學 2014-12-08T15:13:04Z Effect of tertiary amines on yellowing of UV-curable epoxide resins Chiang, Tzu Hsuan; Hsieh, Tsung-Eong
國立交通大學 2014-12-08T15:12:50Z Investigation of electroless Co(W,P) thin film as the diffusion barrier of underbump metallurgy Wu, W. C.; Hsieh, Tsung-Eong; Pan, Hung-Chun
國立交通大學 2014-12-08T15:12:42Z Microstructure and recording mechanism of Bi-Fe-(N) layer for high-density write-once optical disk Mai, Hung-Chuan; Hsieh, Tsung-Eong; Jeng, Shiang-Yao; Chen, Chong-Ming; Wang, Jen-Long
國立交通大學 2014-12-08T15:12:25Z Effects of interface bonding configuration on photoluminescence of ZnO quantum dots-SiOxNy nanocomposite films Peng, Yu-Yun; Hsieh, Tsung-Eong; Hsu, Chia-Hung
國立交通大學 2014-12-08T15:12:06Z Characterization of write-once blu-ray disk containing Cu-Al/Si recording layer using transmission electron microscopy Mai, Hung-Chuan; Hsieh, Tsung-Eong; Jeng, Shiang-Yao
國立交通大學 2014-12-08T15:12:03Z An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W, P) Layer to Lead-Free SnBi Solder Pan, Hung-Chun; Hsieh, Tsung-Eong
國立交通大學 2014-12-08T15:11:47Z Phase-Change Kinetics of Bi-Fe-(N) Layer for High-Speed Write-Once Optical Recording Huang, Sung-Hsiu; Huang, Yu-Jen; Mai, Hung-Chuan; Hsieh, Tsung-Eong
國立交通大學 2014-12-08T15:11:19Z Lifetime improvement of organic light emitting diodes using LiF thin film and UV glue encapsulation Huang, Jian-Ji; Su, Yan-Kuin; Chang, Ming-Hua; Hsieh, Tsung-Eong; Huang, Bohr-Ran; Wang, Shun-Hsi; Chen, Wen-Ray; Tsai, Yu-Sheng; Hsieh, Huai-En; Liu, Mark O.; Juang, Fuh-Shyang
國立交通大學 2014-12-08T15:10:57Z Preparation of epoxy-modified polyethylene by graft extrusion and its applications to polyphenylene sulfide alloys as a compatibilizer Chen, Chen-Ming; Hsieh, Tsung-Eong; Liu, Mark O.

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