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"hsu kuo yuan"
Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T06:04:43Z |
The impact of microstructure end defects on moisture resistance of novel SiOxNy passivation layer for OLED applications
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Chen, Yi-Jen; Hsu, Kuo-Yuan; Chen, Yin-Ying; Su, Cheng-Feng; Tang, Shuenn-Jiun; Leu, Jihperng |
| 國立交通大學 |
2018-01-24T07:41:36Z |
氧化鋅基板-離子場效應電晶體 生物感測模擬器
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徐國元; 渡邊浩志; Hsu, Kuo-Yuan; Hiroshi Watanabe |
| 國立交通大學 |
2014-12-16T06:15:43Z |
METHOD FOR FORMING A POROUS MATERIAL
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Leu, Jih-Perng; Hsu, Kuo-Yuan; Hsu, Hsin-Ling; Chen, Guan-Yu; Takasaka, Nobuo; Hung, Shi-Tsung |
| 國立交通大學 |
2014-12-08T15:21:44Z |
Novel Pore-sealing of Ordered, Porous Silica, SBA-15 for Low-k Underfill Materials
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Hsu, Kuo-Yuan; Chen, Kuei-Yue; Cheng, Ching-Yuan; Lee, Jhih-Jhao; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:07:49Z |
The impact of microstructure end defects on moisture resistance of novel SiO(x)N(y) passivation layer for OLED applications
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Chen, Yi-Jen; Hsu, Kuo-Yuan; Chen, Yin-Ying; Su, Cheng-Feng; Tang, Shuenn-Jiun; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:04:42Z |
Novel Pore-sealing Technology in the Preparation of Low-k Underfill Materials for RF Applications
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Hsu, Kuo-Yuan; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:04:41Z |
Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties
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Chen, Hsin-Yuan; Hsu, Kuo-Yuan; Lin, Tsung-Shu; Leu, Jihperng |
Showing items 1-7 of 7 (1 Page(s) Totally)
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