|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
52189598
在线人数 :
740
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"hsu kuo yuan"的相关文件
显示项目 1-7 / 7 (共1页)
1
每页显示[10|25|50]项目
| 國立交通大學 |
2019-04-02T06:04:43Z |
The impact of microstructure end defects on moisture resistance of novel SiOxNy passivation layer for OLED applications
|
Chen, Yi-Jen; Hsu, Kuo-Yuan; Chen, Yin-Ying; Su, Cheng-Feng; Tang, Shuenn-Jiun; Leu, Jihperng |
| 國立交通大學 |
2018-01-24T07:41:36Z |
氧化鋅基板-離子場效應電晶體 生物感測模擬器
|
徐國元; 渡邊浩志; Hsu, Kuo-Yuan; Hiroshi Watanabe |
| 國立交通大學 |
2014-12-16T06:15:43Z |
METHOD FOR FORMING A POROUS MATERIAL
|
Leu, Jih-Perng; Hsu, Kuo-Yuan; Hsu, Hsin-Ling; Chen, Guan-Yu; Takasaka, Nobuo; Hung, Shi-Tsung |
| 國立交通大學 |
2014-12-08T15:21:44Z |
Novel Pore-sealing of Ordered, Porous Silica, SBA-15 for Low-k Underfill Materials
|
Hsu, Kuo-Yuan; Chen, Kuei-Yue; Cheng, Ching-Yuan; Lee, Jhih-Jhao; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:07:49Z |
The impact of microstructure end defects on moisture resistance of novel SiO(x)N(y) passivation layer for OLED applications
|
Chen, Yi-Jen; Hsu, Kuo-Yuan; Chen, Yin-Ying; Su, Cheng-Feng; Tang, Shuenn-Jiun; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:04:42Z |
Novel Pore-sealing Technology in the Preparation of Low-k Underfill Materials for RF Applications
|
Hsu, Kuo-Yuan; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:04:41Z |
Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties
|
Chen, Hsin-Yuan; Hsu, Kuo-Yuan; Lin, Tsung-Shu; Leu, Jihperng |
显示项目 1-7 / 7 (共1页)
1
每页显示[10|25|50]项目
|
