|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
52582144
在线人数 :
744
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"hsu li han"的相关文件
显示项目 1-10 / 24 (共3页)
1 2 3 > >>
每页显示[10|25|50]项目
| 國立交通大學 |
2019-04-02T06:04:29Z |
An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
|
Wang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立政治大學 |
2017-06 |
The Development and Applications of Three-Dimensional Printing
|
許立涵; Hsu, Li-Han; 佟心平; Tung, Shin-Ping; 林思穎; Lin, Sze-Ying; 林奇秀; Lin, Chi-Shiou |
| 國立交通大學 |
2014-12-16T06:15:45Z |
Vertical Transmission Structure
|
Chang, Edward Yi; Wu, Wei-Cheng; Hwang, Ruey-Bing; Hsu, Li-Han |
| 國立交通大學 |
2014-12-16T06:15:32Z |
High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
|
Chang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te |
| 國立交通大學 |
2014-12-16T06:15:24Z |
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
|
Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:20Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
|
Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-16T06:14:18Z |
High frequency flip chip package process of polymer substrate and structure thereof
|
Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:14Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
|
Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-12T01:23:38Z |
毫微米波段覆晶封裝技術之研究與應用
|
許立翰; Hsu, Li-Han; 張翼; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
|
Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
显示项目 1-10 / 24 (共3页)
1 2 3 > >>
每页显示[10|25|50]项目
|
