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"hsu li han"的相关文件
显示项目 11-20 / 24 (共3页) << < 1 2 3 > >> 每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:48:22Z |
Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation
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Hsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:42:39Z |
Evaluation of Electrical Characteristics of the Copper-Metallized SPDT GaAs Switches at Elevated Temperatures
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Wu, Yun-Chi; Chang, Edward Yi; Lin, Yueh-Chin; Hsu, Li-Han |
| 國立交通大學 |
2014-12-08T15:37:07Z |
An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2014-12-08T15:34:36Z |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:33:04Z |
Evaluation of TiN/Cu Gate Metal Scheme for AlGaN/GaN High-Electron-Mobility Transistor Application
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Lin, Yueh-Chin; Chang, Chih-Hsiang; Li, Fang-Ming; Hsu, Li-Han; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
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Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:28:08Z |
The Circle-grid Electrode on Concentrated GaAs Solar Cells Efficiency
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Chung, Chen-Chen; Yu, Hung-Wei; Hsu, Li-Han; Kuo, Chien-I; Nguyen-Hong Quan; Chiu, Yu-Sheng; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:27:17Z |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
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Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
| 國立交通大學 |
2014-12-08T15:13:11Z |
60 GHz broadband Ms-to-CPW hot-via flip chip interconnects
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Wu, Wei-Cheng; Hsu, Li-Han; Chang, Edward Yi; Kaernfelt, Camilla; Zirath, Herbert; Starski, J. Piotr; Wu, Yun-Chi |
显示项目 11-20 / 24 (共3页) << < 1 2 3 > >> 每页显示[10|25|50]项目
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