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"hsu li han"的相關文件
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| 國立交通大學 |
2019-04-02T06:04:29Z |
An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立政治大學 |
2017-06 |
The Development and Applications of Three-Dimensional Printing
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許立涵; Hsu, Li-Han; 佟心平; Tung, Shin-Ping; 林思穎; Lin, Sze-Ying; 林奇秀; Lin, Chi-Shiou |
| 國立交通大學 |
2014-12-16T06:15:45Z |
Vertical Transmission Structure
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Chang, Edward Yi; Wu, Wei-Cheng; Hwang, Ruey-Bing; Hsu, Li-Han |
| 國立交通大學 |
2014-12-16T06:15:32Z |
High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
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Chang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te |
| 國立交通大學 |
2014-12-16T06:15:24Z |
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:20Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
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Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-16T06:14:18Z |
High frequency flip chip package process of polymer substrate and structure thereof
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:14Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
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Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-12T01:23:38Z |
毫微米波段覆晶封裝技術之研究與應用
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許立翰; Hsu, Li-Han; 張翼; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:48:22Z |
Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation
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Hsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:42:39Z |
Evaluation of Electrical Characteristics of the Copper-Metallized SPDT GaAs Switches at Elevated Temperatures
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Wu, Yun-Chi; Chang, Edward Yi; Lin, Yueh-Chin; Hsu, Li-Han |
| 國立交通大學 |
2014-12-08T15:37:07Z |
An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2014-12-08T15:34:36Z |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:33:04Z |
Evaluation of TiN/Cu Gate Metal Scheme for AlGaN/GaN High-Electron-Mobility Transistor Application
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Lin, Yueh-Chin; Chang, Chih-Hsiang; Li, Fang-Ming; Hsu, Li-Han; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
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Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:28:08Z |
The Circle-grid Electrode on Concentrated GaAs Solar Cells Efficiency
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Chung, Chen-Chen; Yu, Hung-Wei; Hsu, Li-Han; Kuo, Chien-I; Nguyen-Hong Quan; Chiu, Yu-Sheng; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:27:17Z |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
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Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
| 國立交通大學 |
2014-12-08T15:13:11Z |
60 GHz broadband Ms-to-CPW hot-via flip chip interconnects
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Wu, Wei-Cheng; Hsu, Li-Han; Chang, Edward Yi; Kaernfelt, Camilla; Zirath, Herbert; Starski, J. Piotr; Wu, Yun-Chi |
| 國立交通大學 |
2014-12-08T15:09:32Z |
Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects
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Wu, Wei-Cheng; Chang, Edward Yi; Hwang, Ruey-Bing; Hsu, Li-Han; Huang, Chen-Hua; Karnfelt, Camilla; Zirath, Herbert |
| 國立交通大學 |
2014-12-08T15:07:28Z |
Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting |
| 國立成功大學 |
2014-01 |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
| 國立臺灣大學 |
2006 |
Identification of Alpha-Enolase as an Autoantigen in Lung Cancer: Its Overexpression Is Associated with Clinical Outcomes
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張基晟; 劉柯俊; 謝嘉玲; 陸坤泰; 許立翰; 陳姿怡; 陳焜結; 楊宗穎; 周德盈; 彭汪嘉康; CHANG, GEE-CHEN; LIU, KO-JIUNN; HSIEH, CHIA-LING; LUH, KWEN-TAY; HSU, LI-HAN; CHEN, CHIH-YI; CHEN, KUN-CHIEH; YANG, TSUNG-YING; CHOU, TEH-YI; WHANG-PENG, JACQUELINE; SHIH, NENG-YAO |
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