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Taiwan Academic Institutional Repository >
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"hsu li han"
Showing items 1-10 of 24 (3 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T06:04:29Z |
An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立政治大學 |
2017-06 |
The Development and Applications of Three-Dimensional Printing
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許立涵; Hsu, Li-Han; 佟心平; Tung, Shin-Ping; 林思穎; Lin, Sze-Ying; 林奇秀; Lin, Chi-Shiou |
| 國立交通大學 |
2014-12-16T06:15:45Z |
Vertical Transmission Structure
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Chang, Edward Yi; Wu, Wei-Cheng; Hwang, Ruey-Bing; Hsu, Li-Han |
| 國立交通大學 |
2014-12-16T06:15:32Z |
High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
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Chang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te |
| 國立交通大學 |
2014-12-16T06:15:24Z |
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:20Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
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Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-16T06:14:18Z |
High frequency flip chip package process of polymer substrate and structure thereof
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:14Z |
Vertical transmission line structure that includes bump elements for flip-chip mounting
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Chang Edward Yi; Wu Wei-Cheng; Hwang Ruey-Bing; Hsu Li-Han |
| 國立交通大學 |
2014-12-12T01:23:38Z |
毫微米波段覆晶封裝技術之研究與應用
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許立翰; Hsu, Li-Han; 張翼; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
Showing items 1-10 of 24 (3 Page(s) Totally)
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