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Institution Date Title Author
國立交通大學 2020-02-02T23:55:32Z Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin
國立交通大學 2019-04-02T06:00:47Z Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.

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