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Showing items 1-6 of 6 (1 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T05:26:33Z |
Full-wave characterization of a through hole via in multi-layered packaging
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Hsu, S. G.;Wu, Ruey-Beei; Hsu, S. G.; Wu, Ruey-Beei; Wu, Ruey-Beei |
| 淡江大學 |
2005-12 |
A Novel Model Extraction Algorithm for Reconstruction of Coupled Transmission Lines in High-speed Digital System
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Lin, C. J.; 丘建青; Chiu, Chien-ching; Hsu, S. G.; Liu, H. C. |
| 國立臺灣大學 |
1994-11 |
Full Wave Characterization of a Through Hole Via Discontinuity in Multi- Layered Packaging
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Hsu, S. G.; 吳瑞北; Hsu, S. G.; Wu, Ruey-Beei |
| 國立臺灣大學 |
1993-10 |
Full-Wave Characterization of a Through Hole Via
|
Hsu, S. G.; 吳瑞北; Hsu, S. G.; Wu, Ruey-Beei |
| 國立臺灣大學 |
1991-09 |
Analysis of Coplanar Waveguide Discontinuities(1)
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吳瑞北; Mao, M. H.; Hsu, S. G.; Tan, S. F.; Wu, Ruey-Beei; Mao, M. H.; Hsu, S. G.; Tan, S. F. |
| 臺大學術典藏 |
1991-09 |
Analysis of Coplanar Waveguide Discontinuities(1)
|
Mao, M. H.; Hsu, S. G.; Tan, S. F.; Wu, Ruey-Beei; 吳瑞北; Mao, M. H.; Hsu, S. G.; Tan, S. F.; Wu, Ruey-Beei; Hsu, S. G.; Tan, S. F. |
Showing items 1-6 of 6 (1 Page(s) Totally)
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