|
English
|
正體中文
|
简体中文
|
總筆數 :0
|
|
造訪人次 :
52828896
線上人數 :
684
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
"hsu sheng yao"的相關文件
顯示項目 1-10 / 14 (共2頁) 1 2 > >> 每頁顯示[10|25|50]項目
| 國立屏東大學 |
2020 |
鎢酸鹽類晶體合成與光學特性及其第一原理計算之研究
|
許勝堯; HSU, SHENG-YAO |
| 國立交通大學 |
2014-12-16T06:15:00Z |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
|
CHEN KUAN-NENG; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
|
Chen Kuan-Neng; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-12T01:46:21Z |
三維積體電路之銅/鈦接合及其應用之研究
|
徐聖堯; Hsu, Sheng-Yao; 陳冠能; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:32:43Z |
Co-sputtered Cu/Ti Bonded Interconnects for 3D Integration Applications
|
Chen, Hsiao-Yu; Hsu, Sheng-Yao; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:32:19Z |
Electrical Performance and Reliability Investigation of Cosputtered Cu/Ti Bonded Interconnects
|
Chen, Hsiao-Yu; Hsu, Sheng-Yao; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:23:31Z |
Cosputtered Cu/Ti Bonded Interconnects With a Self-Formed Adhesion Layer for Three-Dimensional Integration Applications
|
Hsu, Sheng-Yao; Chen, Hsiao-Yu; Chen, Kuan-Neng |
| 國立成功大學 |
2013-02 |
Dextromethorphan Attenuates LPS-Induced Adhesion Molecule Expression in Human Endothelial Cells
|
Jiang, Shinn-Jong; Hsu, Sheng-Yao; Deng, Chuan-Rou; Huang, Huey-Chun; Liu, Shu-Lin; Shi, Guey-Yueh; Wu, Hua-Lin |
| 慈濟大學 |
2013 |
Dextromethorphan attenuates LPS-induced adhesion molecule expression in human endothelial cells
|
Jiang, Shinn?Jong;Hsu, Sheng?Yao;Deng, Chuan?Rou;Huang, Huey?Chun;Liu, Shu?Lin;Shi, Guey?Yueh;Wu, Hua?Lin |
| 高雄醫學大學 |
2002 |
重症肌無力的比較性研究
|
徐聖曜;蔡榮坤;王惠珠;蘇明揚 ; Hsu, Sheng-Yao;Tsai, Rong-Kung;Wang, Hwei-Zu;Su , Min-Yang |
顯示項目 1-10 / 14 (共2頁) 1 2 > >> 每頁顯示[10|25|50]項目
|