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Institution Date Title Author
臺大學術典藏 2009-02-04T19:31:36Z Full Wave Characterization of a Through Hole Via Discontinuity in Multi- Layered Packaging Hsu, Show-Gwo;Wu, Ruey-Beei; Hsu, Show-Gwo; Wu, Ruey-Beei
臺大學術典藏 2007-04-19T04:38:54Z Full wave characterization of a through hole via Hsu, Show-Gwo;Wu, Ruey-Beei; Hsu, Show-Gwo; Wu, Ruey-Beei
淡江大學 2003 Modeling reconstruction of coupled transmission lines using time-domain characterization in high-speed digital system Liu, Huang-chieh; Hsu, Show-gwo; Lee, Yu-shu; Chiu, Chien-ching
國立臺灣大學 1995 Full-wave characterization of a through hole via in multi-layered packaging Hsu, Show-Gwo; Wu, Ruey-Beei
國立臺灣大學 1994-11 Full wave characterization of a through hole via discontinuity in multi-layered packaging Hsu, Show-Gwo; Wu, Ruey-Beei
國立臺灣大學 1994 Full wave characterization of a through hole via using the matrix-penciled moment method Hsu, Show-Gwo; Wu, Ruey-Beei
國立臺灣大學 1993-10 Full wave characterization of a through hole via Hsu, Show-Gwo; Wu, Ruey-Beei

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