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Institution	Date	Title	Author
國立成功大學	2003-10-06	Enhancement of the wettability and solder joint reliability at the Sn-9Zn0.5Ag lead-free solder alloy-Cu interface by Ag precoating	Chang, Tao-Chih; Hsu, Ying-Tun; Hon, Min-Hsiung; Wang, Moo-Chin

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