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Showing items 1-3 of 3 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:34:36Z |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
| 國立成功大學 |
2014-01 |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
Showing items 1-3 of 3 (1 Page(s) Totally)
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