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"hu yu chen"的相關文件
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| 國立交通大學 |
2018-08-21T05:57:14Z |
Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D Integration
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Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:04Z |
A 64-CHANNEL WIRELESS NEURAL SENSING MICROSYSTEM WITH TSV-EMBEDDED MICRO-PROBE ARRAY FOR NEURAL SIGNAL ACQUISITION
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Huang, Yu-Chieh; Huang, Po-Tsang; Hu, Yu-Chen; Wu, Shang-Lin; You, Yan-Huei; Wang, Yung-Kuei; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern |
| 國立交通大學 |
2018-08-21T05:57:00Z |
An Implantable 128-Channel Wireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable mu-Needle Array and Flexible Interposer
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Huang, Po-Tsang; Huang, Yu-Chieh; Wu, Shang-Lin; Hu, Yu-Chen; Lu, Ming-Wei; Sheng, Ting-Wei; Chang, Fung-Kai; Lin, Chun-Pin; Chang, Nien-Shang; Chen, Hung-Lieh; Chen, Chi-Shi; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern |
| 國立交通大學 |
2018-08-21T05:56:39Z |
An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System
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Hu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:55Z |
An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
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Hu, Yu-Chen; Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chang, Hsiao-Chun; Yang, Yu-Tao; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:32Z |
Graphene oxide sensitizes cancer cells to chemotherapeutics by inducing early autophagy events, promoting nuclear trafficking and necrosis
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Lin, Kuan-Chen; Lin, Mei-Wei; Hsu, Mu-Nung; Guan Yu-Chen; Chao, Yu-Chan; Tuan, Hsing-Yu; Chiang, Chi-Shiun; Hu, Yu-Chen |
| 國立交通大學 |
2018-08-21T05:53:17Z |
Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration
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Shen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:09Z |
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes
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Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Hu, Yu-Chen; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern |
| 國立交通大學 |
2018-01-24T07:39:29Z |
三維異質整合技術應用於超高解析度腦神經訊號擷取感測器
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胡毓宸; 陳冠能; Hu, Yu-Chen; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:50:15Z |
Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits
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Huang, Yu-Chieh; Hu, Yu-Chen; Huang, Po-Tsang; Wu, Shang-Lin; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng |
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