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"huang chia wei"
Showing items 51-57 of 57 (3 Page(s) Totally)
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| 國立成功大學 |
2005-07-04 |
錫鋅系無鉛銲錫(Sn-Zn-Al-Ag Solder)之研究
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黃家緯; Huang, Chia-Wei |
| 國立成功大學 |
2005-07-04 |
錫鋅系無鉛銲錫(Sn-Zn-Al-Ag Solder)之研究
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黃家緯; Huang, Chia-Wei |
| 淡江大學 |
2005 |
Anonymous micropayment schemes with anonymity revocation
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黃嘉濰; Huang, Chia-wei |
| 國立成功大學 |
2004-12 |
Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C
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Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2004-06-11 |
促銷方式、產品涉入程度與促銷情境對消費者品牌評價與購買意願之影響
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黃家蔚; Huang, Chia-Wei |
| 國立成功大學 |
2004-02 |
Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer
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Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2003-07 |
Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders
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Huang, Chia-Wei; Lin, Kwang-Lung |
Showing items 51-57 of 57 (3 Page(s) Totally)
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