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"huang chia wei"的相关文件
显示项目 46-57 / 57 (共3页)
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| 國立成功大學 |
2006-12 |
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2006-11-07 |
A novel inhibitory effect of naloxone on macrophage activation and atherosclerosis formation in mice
|
Liu, Shu-Lin; Li, Yi-Heng; Shi, Guey-Yueh; Chen, Yung-Huan; Huang, Chia-Wei; Hong, Jau-Shyong; Wu, Hua-Lin |
| 國立成功大學 |
2006-06-22 |
2+1維Dirac-Klein-Gordon方程式
|
黃家瑋; Huang, Chia-Wei |
| 國立成功大學 |
2006-03-23 |
The cleavage plane of corneal epithelial adhesion complex in traumatic recurrent corneal erosion
|
Chen, Ying-Ting; Huang, Chia-Wei; Huang, Fu-Chin; Tseng, Shih-Ya; Tseng, Sung-Huei |
| 淡江大學 |
2005-11-15 |
Improvement on Hwang et al.'s generalization of proxy signature schemes based on elliptic curves
|
黃心嘉; Hwang, Shin-jia; Huang, Chia-wei |
| 國立成功大學 |
2005-07-04 |
錫鋅系無鉛銲錫(Sn-Zn-Al-Ag Solder)之研究
|
黃家緯; Huang, Chia-Wei |
| 國立成功大學 |
2005-07-04 |
錫鋅系無鉛銲錫(Sn-Zn-Al-Ag Solder)之研究
|
黃家緯; Huang, Chia-Wei |
| 淡江大學 |
2005 |
Anonymous micropayment schemes with anonymity revocation
|
黃嘉濰; Huang, Chia-wei |
| 國立成功大學 |
2004-12 |
Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2004-06-11 |
促銷方式、產品涉入程度與促銷情境對消費者品牌評價與購買意願之影響
|
黃家蔚; Huang, Chia-Wei |
| 國立成功大學 |
2004-02 |
Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2003-07 |
Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders
|
Huang, Chia-Wei; Lin, Kwang-Lung |
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