臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立臺灣科技大學	2009	Oriented growth of large-scale nickel sulfide nanowire arrays via a general solution route for lithium-ion battery cathode applications	Lai, C.H.;Huang, K.W.;Cheng, J.H.;Lee, C.Y.;Lee, W.F.;Huang, C.T.;Hwang, B.J.;Chen, L.J.
國立臺灣大學	2008	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.
淡江大學	2007-08	Er-doped silicon nanowires with 1.54 μm light-emitting and enhanced electrical and field emission properties	Huang, C. T.; Hsin, C. L.; Huang, K. W.; Lee, C. Y.; Yeh, P. H.; Chen, U. S.; Chen, L. J.
國立東華大學	2006	Photoreflectance and Photoluminescence Study of InxGa1-xAs/GaAs Graded-Channel High Electron Mobility Transistors	Lin,Y. S.; Ho,C. H.; Huang,K. W.
國立東華大學	2005	Practical photoluminescence and photoreflectance spectroscopic system for optical characterization of semiconductor devices	Lin,Y. S.; Lin,D. H.; Ho,C. H.; Huang,K. W.
大葉大學	2004-09-11	A Study of E-Human Resources and E-Learning for High-Tech Cluster Knowledge Workers to Promote the Staffs’ Learning/Growth Performance	Yeh, Y. H.;Huang, K. W
國立臺灣大學	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	Chuang, T. H.; Huang, K. W.; Lin, W. H.
國立臺灣大學	2004	Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints	Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J.
臺大學術典藏	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	ChuangTH; Chuang, T. H.; Huang, K. W.; Lin, W. H.; Chuang, T. H.; Huang, K. W.; Lin, W. H.
臺大學術典藏	2001	Anterior dislocation of the humeral head from bungee jumping [7]	Huang K.-W.; Huang S.-J.; TZU-HSIN LIN; Yen Z.-S.; Chen S.-C.

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