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Showing items 11-21 of 21  (1 Page(s) Totally)
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Institution Date Title Author
中國醫藥大學 2009-06-27 A theory to guide the family care of relatives at risk of suicide 孫凡軻(Fan-Ko Sun); (Ann Long); 黃宣宜(Xuan-Yi Huang); (Huang M.K.)
中國醫藥大學 2009-06-27 Family carers and suicidal ex-patients' perceptions of the provision of care in the home 孫凡軻(Fan-Ko Sun); (Ann Long); 黃宣宜(Xuan-Yi Huang); (Huang M.K.)
中國醫藥大學 2009-06-27 Second year student nurses' perceptions of current or past personal suicidal ideations 孫凡軻(Fan-Ko Sun); (Ann Long); (Huang, M.K.); 黃宣宜(Xuan-Yi Huang)
國立臺灣科技大學 2009 Grouping-based dynamic power management for multi-threaded programs in chip-multiprocessors Huang M.-K.; Chang J.M.; Chen W.-M.
國立臺灣科技大學 2008 Efficient perfectly periodic scheduling for data broadcasting Chen W.-M.; Huang M.-K.
國立臺灣科技大學 2008 Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs Huang, M.-K.;Lee, C.
國立臺灣科技大學 2005 The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints Huang, M.K.;Lee, C.;Wu, P.L.;Tzan, S.R.
國立臺灣科技大學 2004 Effects of different printed circuit board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued small outline J leads/Sn-Pb interfaces Huang, M.K.;Wu, P.L.;Lee, C.
國立臺灣科技大學 2004 Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R.
國立臺灣科技大學 2004 Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R.
國立臺灣科技大學 2004 Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J Leads/Sn-Ag-Cu interfaces Wu, P.L.;Huang, M.K.;Lee, C.Y.;Tzan, S.R.

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