|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"huang shin yi"
Showing items 1-10 of 27 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page
| 國立交通大學 |
2020-07-01T05:21:48Z |
An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications
|
Lin, Yu-Min; Wu, Sheng-Tsai; Shen, Wen-Wei; Huang, Shin-Yi; Kuo, Tzu-Ying; Lin, Ang-Ying; Chang, Tao-Chih; Chang, Hsiang-Hung; Lee, Shu-Man; Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Chen, Kuan-Neng |
| 國立交通大學 |
2020-07-01T05:21:48Z |
Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging
|
Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Lin, Jim-Wein; Lin, Puru; Ko, Cheng-Ta; Chen, Yu-Hua; Shen, Wen-Wei; Kou, Tzu-Ying; Huang, Shin-Yi; Lin, Ang-Ying; Lin, Yu-Min; Chen, Kuan-Neng |
| 國立交通大學 |
2020-02-02T23:55:32Z |
An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
|
Lin, Yu-Min; Wu, Sheng-Tsai; Wang, Chun-Min; Lee, Chia-Hsin; Huang, Shin-Yi; Lin, Ang-Ying; Chang, Tao-Chih; Lin, Puru Bruce; Ko, Cheng-Ta; Chen, Yu-Hua; Su, Jay; Liu, Xiao; Prenger, Luke; Chen, Kuan-Neng |
| 國立成功大學 |
2019-11-18 |
建構居家護理師使用的老人照顧者疏忽風險篩檢量表
|
黃欣怡; Huang, Shin-Yi |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP
|
Shen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:22Z |
Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology
|
Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng |
| 國立成功大學 |
2016-07-21 |
高幀率多光子激發顯微術之研製
|
黃馨儀; Huang, Shin-Yi |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections
|
Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H. |
| 國立高雄師範大學 |
2015-12-01 |
rGO/CS/ZnO奈米複合材料之合成、物性及吸附與降解亞甲藍動力學之研究
|
施伶宜;游奇恩;謝享真;賴翊瑞;陳偉徵;陳榮輝;黃信壹; Shih, Lin-Yi;Yu, Chi-N;Hsieh, Siang-Jhen;Lai, Yi-Jui;Chen, Wei-Jane;Chen, Jung-Hui;Huang, Shin-Yi |
| 國立交通大學 |
2014-12-12T01:57:58Z |
發展流體與質譜法於奈米粒子與生物樣品之分析
|
黃馨儀; Huang, shin-yi; 陳月枝; 帕偉鄂本; Chen,Yu-Chie; Urban, Pawel L. |
Showing items 1-10 of 27 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page
|
