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"huang yan pin"
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| 國立交通大學 |
2018-08-21T05:53:01Z |
Investigation of Cu/In Thermosonic Bonding
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Huang, Yan-Pin; Lu, Shu-Lin; Huang, Yu-Shang; Tseng, Yi-Hsiu; Shu, Min-Fong; Chen, Kuan-Neng |
| 國立交通大學 |
2018-01-24T07:39:30Z |
低溫銅接合製程研究及異質整合平台開發
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黃彥斌; 陳冠能; Huang, Yan-Pin; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T02:59:17Z |
Demonstration and Electrical Performance of Cu-Cu Bonding at 150 degrees C With Pd Passivation
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Huang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Low Temperature (< 180 degrees C) Wafer-level and Chip-level In-to-Cu and Cu-to-Cu Bonding for 3D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:19Z |
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:16Z |
Low Temperature (< 180 degrees C) Bonding for 3D Integration
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Huang, Yan-Pin; Tzeng, Ruoh-Ning; Chien, Yu-San; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:33:26Z |
Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D Integration
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Huang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Tong, Ho-Ming; Chen, Kuan-Neng |
Showing items 1-7 of 7 (1 Page(s) Totally)
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