臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
中國文化大學	2018	Characteristics of Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications	Wu, IC (Wu, I-Chih); Huang, YJ (Huang, Yu-Jung); Wang, MH (Wang, Min-Haw); Jang, LS (Jang, Ling-Sheng)

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