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Institution Date Title Author
國立成功大學 2022-01 Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process Chen;Bo-Heng;Hwang;Sheng-Jye;Chang;Yu-Yang;Yang;Yu-Shuo;Lee;Huei-Huang;Huang;Bing-Yuan;Hu;Ian;Chen;Dao-Long;Tarng;David;Hung;C, P.
國立成功大學 2021-03 Adaptive process control of the changeover point for injection molding process Chen;Yi-Sheng;Wu;Kuo-Tsai;Tsai;Ming-Hong;Hwang;Sheng-Jye;Lee;Huei-Huang;Peng;Hsin-Shu;Chu;Hsiao-Yeh
國立成功大學 2021-02 Study of an Online Monitoring Adaptive System for an Injection Molding Process Based on a Nozzle Pressure Curve Fan-Jiang;Jia-Chen;Su;Chi-Wei;Liou;Guan-Yan;Hwang;Sheng-Jye;Lee;Huei-Huang;Peng;Hsin-Shu;Chu;Hsiao-Yeh
國立成功大學 2020-11 Process optimization for directed energy deposition of SS316L components Lin;Pei-Yi;Shen;Fang-Cheng;Wu;Kuo-Tsai;Hwang;Sheng-Jye;Lee;Huei-Huang
國立成功大學 2020-05 Cutting force validation and volumetric errors compensation of thin workpieces with sensory tool holder Chen;Yu-Wen;Huang;Yao-Fu;Wu;Kuo-Tsai;Hwang;Sheng-Jye;Lee;Huei-Huang
國立成功大學 2020-01 Injection Molding Process Control of Servo-Hydraulic System Lin;Chun-Ying;Shen;Fang-Cheng;Wu;Kuo-Tsai;Lee;Huei-Huang;Hwang;Sheng-Jye
國立成功大學 2019-10 Study of Exposure Uniformity of UV LED Exposure System for Wafer-Level Camera Lenses Wu;Kuo-Tsai;Hwang;Sheng-Jye;Lee;Huei-Huang
國立成功大學 2018-02 Finite element analysis of multi-level interconnection under cyclic thermomechanical loads Wu;Kuo-Tsai;Hwang;Sheng-Jye;Lee;Huei-Huang;Lin;Bing-Yeh
國立成功大學 2017-08 Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill Wu;Kuo-Tsai;Hwang;Sheng-Jye;Lee;Huei-Huang
國立成功大學 2017-06 Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis Wu;Kuo-Tsai;Hwang;Sheng-Jye;Lee;Huei-Huang

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