| 國立成功大學 |
2009-03 |
Effects of defrosting period on mold adhesion force of epoxy molding compound
|
Chen, Hwe-Zhong; Lee, Wen-Hung; Lee, Huei-Huang; Huang, Durn-Yuan; Chang, Shyang-Jye; Hwang, Sheng-Jye |
| 國立成功大學 |
2008-10 |
Simulation and Design of Multiple-Station Rolling Forming for U-Section Steel Bar
|
Lin, Chin-Wei; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2008-10 |
Reduction of Photo Leakage Current of Hydrogenated Amorphous Silicon Thin Film Transistors
|
Liu, Yu-Ting; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2008-01 |
Simulations and experiments of three-dimensional paddle shift for IC packaging
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-12 |
Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-09 |
Simulations of process-induced warpage during IC encapsulation process
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-04-12 |
Development of an external-type microinjection molding module for thermoplastic polymer
|
Chang, Pei-Chi; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Dum-Yuan |
| 國立成功大學 |
2006-11-15 |
Experimental investigation of infrared rapid surface heating for injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-10 |
Simulation of infrared rapid surface heating for injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-09-25 |
The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold
|
Chiu, S. M.; Hwang, Sheng-Jye; Chu, C. W.; Gan, Dershin |
| 國立成功大學 |
2006-03 |
P-V-T-C equation for epoxy molding compound
|
Hwang, Sheng-Jye; Chang, Yi-San |
| 國立成功大學 |
2006-02 |
Injection molding of microprobe array parts
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006 |
vGeometry influence of reflectors for infrared rapid heating on micro-injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006 |
Design and verification of a clamping system for micro-injection molding machine
|
Chang, P. C.; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, D. Y. |
| 國立成功大學 |
2005-09-01 |
Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state
|
Hwang, Sheng-Jye; Chang, Yi-San |
| 國立成功大學 |
2005-09 |
Three-dimensional paddle shift modeling for IC packaging
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-09 |
Prediction of wire sweep during the encapsulation of IC packaging with wire density effect
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-04 |
Static analysis of the die picking process
|
Lin, Yeong-Jyh; Hwang, Sheng-Jye |
| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
|
Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-10 |
Design and fabrication of an IC encapsulation mold adhesion force tester
|
Chang, Shyang-Jye; Hwang, Sheng-Jye |
| 國立成功大學 |
2003-06 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2003-03 |
An efficient solution for wire sweep analysis in IC packaging
|
Su, Jerry; Hwang, Sheng-Jye; Su, Francis; Chen, Shou-Kang |
| 國立成功大學 |
2003-01 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2002-12 |
Study of P-V-T-C relation of EMC
|
Chang, Yi-San; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
| 國立成功大學 |
2002-07 |
Nonlinear time-dependent thermoelastic response in a multilayered anisotropic medium
|
Chen, Tei-Chen; Hwang, Sheng-Jye; Chen, Chang-Qua |
