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教育部委托研究计画 计画执行:国立台湾大学图书馆
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"hwang sheng jye"的相关文件
显示项目 46-55 / 61 (共7页)
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| 國立成功大學 |
2006-03 |
P-V-T-C equation for epoxy molding compound
|
Hwang, Sheng-Jye; Chang, Yi-San |
| 國立成功大學 |
2006-02 |
Injection molding of microprobe array parts
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006 |
vGeometry influence of reflectors for infrared rapid heating on micro-injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006 |
Design and verification of a clamping system for micro-injection molding machine
|
Chang, P. C.; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, D. Y. |
| 國立成功大學 |
2005-09-01 |
Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state
|
Hwang, Sheng-Jye; Chang, Yi-San |
| 國立成功大學 |
2005-09 |
Three-dimensional paddle shift modeling for IC packaging
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-09 |
Prediction of wire sweep during the encapsulation of IC packaging with wire density effect
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-04 |
Static analysis of the die picking process
|
Lin, Yeong-Jyh; Hwang, Sheng-Jye |
| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
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Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-10 |
Design and fabrication of an IC encapsulation mold adhesion force tester
|
Chang, Shyang-Jye; Hwang, Sheng-Jye |
显示项目 46-55 / 61 (共7页)
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