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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
國立成功大學 2013-02 Design and fabrication of an adhesion force tester for the injection moulding process Chen, Jian-Yu; Hwang, Sheng-Jye
國立成功大學 2012-07 Investigation of adhesion phenomena in thermoplastic polyurethane injection molding process Chen, Jian-Yu; Hwang, Sheng-Jye
國立成功大學 2012-01-26 電磁熱療法之治療器具 李國賓; Lin, Xi-Zhang; Huang, Sheng-Chieh; Chang, Yi-Yuan; Shan, Yan-Shen; Hwang, Sheng-Jye; Lee, Tung-Jen; Chen, Szu-Yin; Chen, Ping-Hen
國立成功大學 2011-11 Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing Lin, Yeong-Jyh; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan
國立成功大學 2011-01 Volume Shrinkage Characterization of Underfill Materials Deng, Shang-Shiuan; Ho, Chia-Yi; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan
國立成功大學 2009-03 Effects of defrosting period on mold adhesion force of epoxy molding compound Chen, Hwe-Zhong; Lee, Wen-Hung; Lee, Huei-Huang; Huang, Durn-Yuan; Chang, Shyang-Jye; Hwang, Sheng-Jye
國立成功大學 2008-10 Simulation and Design of Multiple-Station Rolling Forming for U-Section Steel Bar Lin, Chin-Wei; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan
國立成功大學 2008-10 Reduction of Photo Leakage Current of Hydrogenated Amorphous Silicon Thin Film Transistors Liu, Yu-Ting; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan
國立成功大學 2008-01 Simulations and experiments of three-dimensional paddle shift for IC packaging Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學 2007-12 Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method Teng, Shiang-Yu; Hwang, Sheng-Jye

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