| 國立成功大學 |
2016-01-25 |
Synthesis and hydrogen absorption/desorption properties of Mg-Nb2O5-SWCNT/MWCNT nanocomposite prepared by reactive milling
|
Chuang, Yu-Siang; Hwang, Sheng-Jye |
| 國立成功大學 |
2016 |
Design with White Light-Emitting Diodes for an Automotive Low-Beam Projector Headlamp
|
Chiang, Yueh-Ying; Hwang, Sheng-Jye; Lee, Huei-Huang; Hwang, Deng-Yuan; Liao, Chien-Chih |
| 國立成功大學 |
2015-12 |
Production of Gas-Atomized Aluminum Alloy Powders for Metal Additive Manufacturing Processes
|
Wang, Muh-Rong; Huang, Yang-Sheng; Tseng, Wei-Chieh; Lai, Kuan-Lan; Hwang, Sheng-Jye |
| 國立成功大學 |
2015-07 |
Modeling a working coil coupled with magnetic flux concentrators for barrel induction heating in an injection molding machine
|
Bui, Huy-Tien; Hwang, Sheng-Jye |
| 國立成功大學 |
2015-02 |
Design of an induction heating coil coupled with magnetic flux concentrators for barrel heating of an injection molding machine
|
Bui, Huy-Tien; Hwang, Sheng-Jye |
| 國立成功大學 |
2015 |
Development of barrel heating system in injection molding machine via induction heating
|
Bui, Huy-Tien; Hwang, Sheng-Jye |
| 國立成功大學 |
2014-12-12 |
On a porous medium combustor for hydrogen flame stabilization and operation
|
Su, Siou-Sheng; Hwang, Sheng-Jye; Lai, Wei-Hsiang |
| 國立成功大學 |
2014-08 |
Effect of Nb2O5 and SWCNT on the H-2 sorption properties of Mg-based hydrogen storage system
|
Chuang, Yu-Siang; Hwang, Sheng-Jye |
| 國立成功大學 |
2014 |
Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating
|
Sung, Yu-Ting; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
| 國立成功大學 |
2013-03 |
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
|
Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang |
| 國立成功大學 |
2013-02 |
Design and fabrication of an adhesion force tester for the injection moulding process
|
Chen, Jian-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2012-07 |
Investigation of adhesion phenomena in thermoplastic polyurethane injection molding process
|
Chen, Jian-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2012-01-26 |
電磁熱療法之治療器具
|
李國賓; Lin, Xi-Zhang; Huang, Sheng-Chieh; Chang, Yi-Yuan; Shan, Yan-Shen; Hwang, Sheng-Jye; Lee, Tung-Jen; Chen, Szu-Yin; Chen, Ping-Hen |
| 國立成功大學 |
2011-11 |
Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing
|
Lin, Yeong-Jyh; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
| 國立成功大學 |
2011-01 |
Volume Shrinkage Characterization of Underfill Materials
|
Deng, Shang-Shiuan; Ho, Chia-Yi; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2009-03 |
Effects of defrosting period on mold adhesion force of epoxy molding compound
|
Chen, Hwe-Zhong; Lee, Wen-Hung; Lee, Huei-Huang; Huang, Durn-Yuan; Chang, Shyang-Jye; Hwang, Sheng-Jye |
| 國立成功大學 |
2008-10 |
Simulation and Design of Multiple-Station Rolling Forming for U-Section Steel Bar
|
Lin, Chin-Wei; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2008-10 |
Reduction of Photo Leakage Current of Hydrogenated Amorphous Silicon Thin Film Transistors
|
Liu, Yu-Ting; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2008-01 |
Simulations and experiments of three-dimensional paddle shift for IC packaging
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-12 |
Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-09 |
Simulations of process-induced warpage during IC encapsulation process
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-04-12 |
Development of an external-type microinjection molding module for thermoplastic polymer
|
Chang, Pei-Chi; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Dum-Yuan |
| 國立成功大學 |
2006-11-15 |
Experimental investigation of infrared rapid surface heating for injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-10 |
Simulation of infrared rapid surface heating for injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-09-25 |
The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold
|
Chiu, S. M.; Hwang, Sheng-Jye; Chu, C. W.; Gan, Dershin |
