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"hwang sheng jye"的相关文件
显示项目 36-45 / 61 (共7页)
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| 國立成功大學 |
2009-03 |
Effects of defrosting period on mold adhesion force of epoxy molding compound
|
Chen, Hwe-Zhong; Lee, Wen-Hung; Lee, Huei-Huang; Huang, Durn-Yuan; Chang, Shyang-Jye; Hwang, Sheng-Jye |
| 國立成功大學 |
2008-10 |
Simulation and Design of Multiple-Station Rolling Forming for U-Section Steel Bar
|
Lin, Chin-Wei; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2008-10 |
Reduction of Photo Leakage Current of Hydrogenated Amorphous Silicon Thin Film Transistors
|
Liu, Yu-Ting; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2008-01 |
Simulations and experiments of three-dimensional paddle shift for IC packaging
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-12 |
Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-09 |
Simulations of process-induced warpage during IC encapsulation process
|
Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-04-12 |
Development of an external-type microinjection molding module for thermoplastic polymer
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Chang, Pei-Chi; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Dum-Yuan |
| 國立成功大學 |
2006-11-15 |
Experimental investigation of infrared rapid surface heating for injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-10 |
Simulation of infrared rapid surface heating for injection molding
|
Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-09-25 |
The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold
|
Chiu, S. M.; Hwang, Sheng-Jye; Chu, C. W.; Gan, Dershin |
显示项目 36-45 / 61 (共7页)
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