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Showing items 36-45 of 61  (7 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2009-03 Effects of defrosting period on mold adhesion force of epoxy molding compound Chen, Hwe-Zhong; Lee, Wen-Hung; Lee, Huei-Huang; Huang, Durn-Yuan; Chang, Shyang-Jye; Hwang, Sheng-Jye
國立成功大學 2008-10 Simulation and Design of Multiple-Station Rolling Forming for U-Section Steel Bar Lin, Chin-Wei; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan
國立成功大學 2008-10 Reduction of Photo Leakage Current of Hydrogenated Amorphous Silicon Thin Film Transistors Liu, Yu-Ting; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan
國立成功大學 2008-01 Simulations and experiments of three-dimensional paddle shift for IC packaging Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學 2007-12 Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學 2007-09 Simulations of process-induced warpage during IC encapsulation process Teng, Shiang-Yu; Hwang, Sheng-Jye
國立成功大學 2007-04-12 Development of an external-type microinjection molding module for thermoplastic polymer Chang, Pei-Chi; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Dum-Yuan
國立成功大學 2006-11-15 Experimental investigation of infrared rapid surface heating for injection molding Chang, Pei-Chi; Hwang, Sheng-Jye
國立成功大學 2006-10 Simulation of infrared rapid surface heating for injection molding Chang, Pei-Chi; Hwang, Sheng-Jye
國立成功大學 2006-09-25 The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold Chiu, S. M.; Hwang, Sheng-Jye; Chu, C. W.; Gan, Dershin

Showing items 36-45 of 61  (7 Page(s) Totally)
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