|
English
|
正體中文
|
简体中文
|
2851792
|
|
???header.visitor??? :
44713086
???header.onlineuser??? :
1086
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"hwang sheng jye"???jsp.browse.items-by-author.description???
Showing items 51-60 of 61 (7 Page(s) Totally)
<< < 1 2 3 4 5 6 7 > >>
View [10|25|50] records per page
| 國立成功大學 |
2005-09 |
Three-dimensional paddle shift modeling for IC packaging
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-09 |
Prediction of wire sweep during the encapsulation of IC packaging with wire density effect
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-04 |
Static analysis of the die picking process
|
Lin, Yeong-Jyh; Hwang, Sheng-Jye |
| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
|
Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-10 |
Design and fabrication of an IC encapsulation mold adhesion force tester
|
Chang, Shyang-Jye; Hwang, Sheng-Jye |
| 國立成功大學 |
2003-06 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2003-03 |
An efficient solution for wire sweep analysis in IC packaging
|
Su, Jerry; Hwang, Sheng-Jye; Su, Francis; Chen, Shou-Kang |
| 國立成功大學 |
2003-01 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2002-12 |
Study of P-V-T-C relation of EMC
|
Chang, Yi-San; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
| 國立成功大學 |
2002-07 |
Nonlinear time-dependent thermoelastic response in a multilayered anisotropic medium
|
Chen, Tei-Chen; Hwang, Sheng-Jye; Chen, Chang-Qua |
Showing items 51-60 of 61 (7 Page(s) Totally)
<< < 1 2 3 4 5 6 7 > >>
View [10|25|50] records per page
|
