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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"hwang sheng jye"的相關文件
顯示項目 51-61 / 61 (共2頁)
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| 國立成功大學 |
2005-09 |
Three-dimensional paddle shift modeling for IC packaging
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-09 |
Prediction of wire sweep during the encapsulation of IC packaging with wire density effect
|
Pei, Chien-Chang; Hwang, Sheng-Jye |
| 國立成功大學 |
2005-04 |
Static analysis of the die picking process
|
Lin, Yeong-Jyh; Hwang, Sheng-Jye |
| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
|
Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-10 |
Design and fabrication of an IC encapsulation mold adhesion force tester
|
Chang, Shyang-Jye; Hwang, Sheng-Jye |
| 國立成功大學 |
2003-06 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
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Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2003-03 |
An efficient solution for wire sweep analysis in IC packaging
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Su, Jerry; Hwang, Sheng-Jye; Su, Francis; Chen, Shou-Kang |
| 國立成功大學 |
2003-01 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2002-12 |
Study of P-V-T-C relation of EMC
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Chang, Yi-San; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
| 國立成功大學 |
2002-07 |
Nonlinear time-dependent thermoelastic response in a multilayered anisotropic medium
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Chen, Tei-Chen; Hwang, Sheng-Jye; Chen, Chang-Qua |
| 國立成功大學 |
2000-12 |
Prediction of paddle shift via 3-D TSOP modeling
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Su, Francis; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
顯示項目 51-61 / 61 (共2頁)
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