臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:23:37Z	A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application	Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng

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