臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
義守大學	2018-04	Characteristics of a Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications	I-Chih Wu;Yu-Jung Huang;Min-Haw Wang;Ling-Sheng Jang
義守大學	2004	SoC構裝電性及故障模式分析之研究	吳亦智; I-Chih Wu
義守大學	2002-12	Failure analysis of BGA package by a TDR approach	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;I-Chih Wu

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