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Institution	Date	Title	Author
國立中山大學	2002	The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages	M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kung;K.C. Hsieh;W.H. Cheng;

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