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總筆數 :2875249
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造訪人次 :
54222127
線上人數 :
1370
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"jyh jone lee"的相關文件
顯示項目 6-15 / 39 (共4頁) 1 2 3 4 > >> 每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2022-03-22T08:25:54Z |
Design of a monolithic constant-force compliant mechanism for extended range of motion and minimal force variation
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Lo C.-W;Chang Y;Wang M.-L;Lin C.-R;Lee J.-J.; Lo C.-W; Chang Y; Wang M.-L; Lin C.-R; Lee J.-J.; JYH-JONE LEE |
| 臺大學術典藏 |
2022-03-22T08:25:54Z |
Development of an adaptive explicit algorithm for static simulation using the vector form intrinsic finite element method
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Wang M.-L;Chuang C.-C;Lee J.-J.; Wang M.-L; Chuang C.-C; Lee J.-J.; JYH-JONE LEE |
| 臺大學術典藏 |
2021-12-21T23:16:49Z |
Design of a monolithic constant-force compliant mechanism for extended range of motion and minimal force variation
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Lo, Ching Wei; Chang, Yuan; Wang, Mien Li; Lin, Cian Ru; JYH-JONE LEE |
| 臺大學術典藏 |
2021-11-21T23:18:47Z |
Development of an adaptive explicit algorithm for static simulation using the vector form intrinsic finite element method
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Wang, Mien Li; Chuang, Ching Chiang; JYH-JONE LEE |
| 臺大學術典藏 |
2021-08-05T02:37:24Z |
Robot grasping in dense clutter via view-based experience transfer
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Wang J.-W;Li C.-L;Chen J.-L;Lee J.-J.; Wang J.-W; Li C.-L; Chen J.-L; Lee J.-J.; JYH-JONE LEE |
| 臺大學術典藏 |
2020-01-13T08:21:10Z |
Kinematic analysis of tendon-driven robotic mechanisms using graph theory
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Tsai, L.-W.; Lee, J.-J.; JYH-JONE LEE |
| 臺大學術典藏 |
2018-09-10T15:20:40Z |
On the kinematics of a new parallel mechanism with Schoenflies motion
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Lee, P.-C.; Lee, J.-J.; JYH-JONE LEE |
| 臺大學術典藏 |
2018-09-10T14:55:19Z |
Design of a two-stage cycloidal gear reducer with tooth modifications
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Lin, W.-S.; Shih, Y.-P.; Lee, J.-J.; JYH-JONE LEE |
| 臺大學術典藏 |
2018-09-10T09:45:27Z |
Residual stress of curvature sapphire substrate with GaN film released by the application of trench structures
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Liao, M.-H.; Lee, J.-J.; Chen, C.-H.; Kao, S.-C.; Chen, K.-C.; Hsieh, C.-F.; JYH-JONE LEE |
| 臺大學術典藏 |
2018-09-10T09:45:27Z |
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
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JYH-JONE LEE;Liang, J.H.;Chen, K.C.;Lee, J.J.;Chen, C.-H.;Liao, M.-H.;JYH-JONE LEE; Liao, M.-H.; Chen, C.-H.; Lee, J.J.; Chen, K.C.; Liang, J.H.; JYH-JONE LEE |
顯示項目 6-15 / 39 (共4頁) 1 2 3 4 > >> 每頁顯示[10|25|50]項目
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