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"kho yi tung"的相关文件
显示项目 1-7 / 7 (共1页)
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| 國立交通大學 |
2020-07-01T05:21:48Z |
Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D Integration
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Lu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-02T05:59:00Z |
Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration
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Lu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
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Chen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:46Z |
Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration
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Lu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:52Z |
Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding
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Tang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:52:50Z |
Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints
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Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng |
| 國立交通大學 |
2018-01-24T07:39:05Z |
三維積體電路異質整合技術開發之聚醯亞胺材料與鈍化層附著強度以及鈷金屬超薄緩衝層應用於混合接合之研究
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許浴桐; 陳冠能; Kho, Yi-Tung; Chen, Kuan-Neng |
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