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"ko cheng ta"的相关文件
显示项目 1-26 / 26 (共1页)
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| 國立交通大學 |
2020-10-05T02:01:56Z |
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2020-10-05T02:01:28Z |
Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Chung, Ying-Ting; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2020-07-01T05:21:48Z |
Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging
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Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Lin, Jim-Wein; Lin, Puru; Ko, Cheng-Ta; Chen, Yu-Hua; Shen, Wen-Wei; Kou, Tzu-Ying; Huang, Shin-Yi; Lin, Ang-Ying; Lin, Yu-Min; Chen, Kuan-Neng |
| 國立交通大學 |
2020-02-02T23:55:32Z |
An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
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Lin, Yu-Min; Wu, Sheng-Tsai; Wang, Chun-Min; Lee, Chia-Hsin; Huang, Shin-Yi; Lin, Ang-Ying; Chang, Tao-Chih; Lin, Puru Bruce; Ko, Cheng-Ta; Chen, Yu-Hua; Su, Jay; Liu, Xiao; Prenger, Luke; Chen, Kuan-Neng |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package
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Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
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Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
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Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
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Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang |
| 國立交通大學 |
2018-08-21T05:52:44Z |
Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
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Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:12Z |
Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer Fabrication
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Shen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T02:59:12Z |
Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O Application
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Chang, Yao-Yen; Ko, Cheng-Ta; Yu, Tsung-Han; Hsieh, Yu-Sheng; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-16T06:15:03Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
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CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:14:52Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
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CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Heterostructure containing IC and LED and method for fabricating the same
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Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-16T06:13:53Z |
Heterostructure containing IC and LED and method for fabricating the same
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Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-12T02:45:18Z |
低溫晶圓接合研究及其三維堆疊整合應用
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柯正達; Ko, Cheng-Ta; 陳冠能; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:48Z |
Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications
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Shih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:21Z |
A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
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Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:41Z |
Sealing Bump With Bottom-Up Cu TSV Plating Fabrication in 3-D Integration Scheme
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Chiang, Cheng-Hao; Kuo, Li-Min; Hu, Yu-Chen; Huang, Wen-Chun; Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:29:51Z |
Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid Bonding
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Chang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:29:39Z |
Reliability of key technologies in 3D integration
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Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:28:43Z |
Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme
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Chang, Yao-Jen; Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:23:44Z |
Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
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Chen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung |
| 國立交通大學 |
2014-12-08T15:23:37Z |
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Low temperature bonding technology for 3D integration
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Ko, Cheng-Ta; Chen, Kuan-Neng |
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