| 國立交通大學 |
2015-12-02T02:59:12Z |
Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O Application
|
Chang, Yao-Yen; Ko, Cheng-Ta; Yu, Tsung-Han; Hsieh, Yu-Sheng; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-16T06:15:03Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
|
CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:14:52Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
|
CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Heterostructure containing IC and LED and method for fabricating the same
|
Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-16T06:13:53Z |
Heterostructure containing IC and LED and method for fabricating the same
|
Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-12T02:45:18Z |
低溫晶圓接合研究及其三維堆疊整合應用
|
柯正達; Ko, Cheng-Ta; 陳冠能; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:48Z |
Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications
|
Shih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:21Z |
A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
|
Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
|
Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:41Z |
Sealing Bump With Bottom-Up Cu TSV Plating Fabrication in 3-D Integration Scheme
|
Chiang, Cheng-Hao; Kuo, Li-Min; Hu, Yu-Chen; Huang, Wen-Chun; Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:29:51Z |
Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid Bonding
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Chang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:29:39Z |
Reliability of key technologies in 3D integration
|
Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:28:43Z |
Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme
|
Chang, Yao-Jen; Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:23:44Z |
Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
|
Chen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung |
| 國立交通大學 |
2014-12-08T15:23:37Z |
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
|
Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Low temperature bonding technology for 3D integration
|
Ko, Cheng-Ta; Chen, Kuan-Neng |
