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Showing items 6-15 of 26 (3 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T06:04:30Z |
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
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Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
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Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
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Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang |
| 國立交通大學 |
2018-08-21T05:52:44Z |
Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
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Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:12Z |
Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer Fabrication
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Shen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T02:59:12Z |
Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O Application
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Chang, Yao-Yen; Ko, Cheng-Ta; Yu, Tsung-Han; Hsieh, Yu-Sheng; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-16T06:15:03Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
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CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:14:52Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
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CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Heterostructure containing IC and LED and method for fabricating the same
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Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-16T06:13:53Z |
Heterostructure containing IC and LED and method for fabricating the same
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Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
Showing items 6-15 of 26 (3 Page(s) Totally)
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