|
English
|
正體中文
|
简体中文
|
2809530
|
|
???header.visitor??? :
27022790
???header.onlineuser??? :
333
???header.sponsordeclaration???
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"koike junichi"???jsp.browse.items-by-author.description???
Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2020-03-09 |
Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO2
|
Wu, Pu-Wei; Koike, Junichi; Dordi, Yezdi; Chung, Wei-An; Fan, Tzu-Ling; Chou, Shih-Cheng |
國立交通大學 |
2019-08-02T02:15:34Z |
Conformal Deposition of RuO2 on Cu via a Galvanic Cementation Reaction
|
Lin, Chun; Chou, Shih-Cheng; Tso, Kuang-Chih; Hsieh, Yi-Chieh; Chan, Ting-Shan; Chen, Po-Chun; Koike, Junichi; Wu, Pu-Wei |
Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
|