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"krug klaus"

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Institution Date Title Author
嘉南藥理大學 2018-06 Adsorption Behavior of TBPS in the Process of Cu Electrodeposition on an Au Film Chen, Liang-Huei; Liu, Yung-Fang; Krug, Klaus; Lee, Yuh-Lang
國立成功大學 2013 Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating Chan, Po-Fan; Chiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Lee, Yuh-Lang; Yau, Shueh-Lin
國立成功大學 2013 Self-organization of two-dimensional poly(3-hexylthiophene) crystals on Au(111) surfaces Liu, Yung-Fang; Krug, Klaus; Lee, Yuh-Lang
國立成功大學 2012-10-09 Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes Chiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin
國立成功大學 2012-08-23 Electrochemical Cu Growth on MPS-Modified Au(111) Electrodes Krug, Klaus; Liu, Yung-Fang; Ho, Wen-Hsiang; Lee, Yuh-Lang; Dow, Wei-Ping; Yau, Shueh-Lin
國立成功大學 2012 In Situ STM Study of Cu Electrodeposition on TBPS-Modified Au(111) Electrodes Liu, Yung-Fang; Krug, Klaus; Lin, Pin-Chun; Chiu, Yong-Da; Dow, Wei-Ping; Yau, Shueh-Lin; Lee, Yuh-Lang
國立成功大學 2011-04-21 Scanning Tunneling Microscopy and Cyclic Voltammetry Study of Self-Assembled 3,3 '-Thiobis(1-propanesulfonic acid, sodium salt) Monolayers on Au(111) Electrodes Liu, Yung-Fang; Krug, Klaus; Lin, Pin-Chun; Chiu, Yong-Da; Lee, Yuh-Lang; Dow, Wei-Ping

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