| 臺大學術典藏 |
2020-01-13T08:21:21Z |
Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process
|
KUAN-MING LI; Li, K.-M.; Tang, C.-W.; Young, H.-T. |
| 臺大學術典藏 |
2020-01-13T08:21:21Z |
Design of an LTCC Tri-Band Transceiver Module for GPRS Mobile Applications
|
Lin, Y.-S.; Liu, C.-C.; Li, K.-M.; Chen, C.H.; KUAN-MING LI |
| 臺大學術典藏 |
2019-11-25T07:28:04Z |
Tool condition monitoring with current signals for a low-power spindle
|
KUAN-MING LI;Li K.M.;Young H.T.;Chung T.T.;Huang M.;Wang C.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M.; KUAN-MING LI |
| 臺大學術典藏 |
2019-11-25T07:28:03Z |
On the Thermal Memory Effect Reduction of Power Amplifiers Using Pulse Modulation
|
KUAN-MING LI;Staudinger J.;Chen J.-H.;Li K.-M.;Chang C.-W.;Chen Y.-H.;Wang T.-H.; Wang T.-H.; Chen Y.-H.; Chang C.-W.; Li K.-M.; Chen J.-H.; Staudinger J.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T15:20:42Z |
Parameter optimization of micromilling brass mold inserts for microchannels with Taguchi method
|
Chen, P.-C.; Chen, Y.-C.; Pan, C.-W.; Li, K.-M.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T14:55:27Z |
Optimization of micromilling microchannels on a polycarbonate substrate
|
Lee, W.-C.; Li, K.-M.; KUAN-MING LI; Pan, C.-W.; Chen, P.-C. |
| 臺大學術典藏 |
2018-09-10T14:55:27Z |
Effect of tool wear in ultrasonic vibration-assisted micro-milling
|
Li, K.-M.; Wang, S.-L.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T14:55:27Z |
An experimental study of micromilling parameters to manufacture microchannels on a PMMA substrate
|
KUAN-MING LI;Li, K.-M.;Lee, W.-C.;Pan, C.-W.;Chen, P.-C.;KUAN-MING LI; Chen, P.-C.; Pan, C.-W.; Lee, W.-C.; Li, K.-M.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:45:33Z |
An improved remote sensing technique for estimating tool-chip interface temperatures in turning
|
KUAN-MING LI;Chu, W.-Y.;Wang, C.;Li, K.-M.;KUAN-MING LI; Li, K.-M.; Wang, C.; Chu, W.-Y.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy
|
Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:21Z |
Study on minimum quantity lubrication in micro-grinding
|
KUAN-MING LI;Lin, C.-P.;Li, K.-M.;KUAN-MING LI; Li, K.-M.; Lin, C.-P.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:21Z |
Flank wear model for near dry turning under built-up edge effect
|
Li, K.-M.; Liang, S.Y.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:21Z |
Experimental study on vibration-assisted grinding
|
Li, K.-M.; Hu, Y.-M.; Yang, Z.-Y.; Chen, M.-Y.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:21Z |
Experimental Study on Minimum Quantity Lubrication in Mechanical Micromachining
|
Li, K.-M.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Innovative through-silicon-via formation approach for wafer-level packaging applications
|
Li, Kuan Ming; KUAN-MING LI; Young, Hong Tsu; Tang, Chao Wei; HONG-TSU YOUNG; Li, Kuan Ming; Young, Hong Tsu; Tang, Chao Wei; Tang, C.W.; Young, H.T.; Li, K.M. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process
|
Tang, C.-W.; Young, H.-T.; Li, K.-M.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T08:38:20Z |
Effect of machining parameters on surface roughness in vibration-assisted grinding
|
Li, K.-M.; Hu, Y.-M.; Yang, Z.-Y.; Chen, M.-Y.; Hsu, F.-C.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T08:11:27Z |
Experimental evaluation of minimum quantity lubrication in near micro-milling
|
Li, K.-M.; Chou, S.-Y.; Li, Kuan-Ming; Chou, Shih-Yen; Li, Kuan-Ming; KUAN-MING LI; Chou, Shih-Yen |
| 臺大學術典藏 |
2018-09-10T07:32:07Z |
Effect of minimum quantity lubrication on tool wear and surface roughness in micro-milling
|
Li, K.-M.; Chou, S.-Y.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T06:26:21Z |
Predictive modeling of flank wear in turning under flood cooling
|
Li, K.-M.; Liang, S.Y.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T06:26:21Z |
Performance profiling of minimum quantity lubrication in machining
|
Li, K.-M.; Liang, S.Y.; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T05:19:30Z |
Predictive models for flank wear in near dry machining
|
Li, K.-M.; Liang, S.Y.; KUAN-MING LI |
| 臺大學術典藏 |
2012 |
Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process
|
Tang, C.-W.; Li, K.-M.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2012 |
A pulsed-biasing strain gauge measurement system for wireless sensing applications
|
KUAN-MING LI; Chen, J.-H.; Li, K.-M.; Lee, G.-L.; KUAN-MING LI;Li, K.-M.;Chen, J.-H.;Lee, G.-L.;KUAN-MING LI |
| 國立中山大學 |
2009 |
微潤滑於超音波輔助切削之影響
|
李貫銘; Kuan-Ming Li |
