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Institution Date Title Author
臺大學術典藏 2018-09-10T09:19:04Z Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process Tang, C.-W.; Young, H.-T.; Li, K.-M.; HONG-TSU YOUNG; KUAN-MING LI
臺大學術典藏 2018-09-10T08:38:20Z Effect of machining parameters on surface roughness in vibration-assisted grinding Li, K.-M.; Hu, Y.-M.; Yang, Z.-Y.; Chen, M.-Y.; Hsu, F.-C.; KUAN-MING LI
臺大學術典藏 2018-09-10T08:11:27Z Experimental evaluation of minimum quantity lubrication in near micro-milling Li, K.-M.; Chou, S.-Y.; Li, Kuan-Ming; Chou, Shih-Yen; Li, Kuan-Ming; KUAN-MING LI; Chou, Shih-Yen
臺大學術典藏 2018-09-10T07:32:07Z Effect of minimum quantity lubrication on tool wear and surface roughness in micro-milling Li, K.-M.; Chou, S.-Y.; KUAN-MING LI
臺大學術典藏 2018-09-10T06:26:21Z Predictive modeling of flank wear in turning under flood cooling Li, K.-M.; Liang, S.Y.; KUAN-MING LI
臺大學術典藏 2018-09-10T06:26:21Z Performance profiling of minimum quantity lubrication in machining Li, K.-M.; Liang, S.Y.; KUAN-MING LI
臺大學術典藏 2018-09-10T05:19:30Z Predictive models for flank wear in near dry machining Li, K.-M.; Liang, S.Y.; KUAN-MING LI
臺大學術典藏 2012 Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process Tang, C.-W.; Li, K.-M.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI
臺大學術典藏 2012 A pulsed-biasing strain gauge measurement system for wireless sensing applications KUAN-MING LI; Chen, J.-H.; Li, K.-M.; Lee, G.-L.; KUAN-MING LI;Li, K.-M.;Chen, J.-H.;Lee, G.-L.;KUAN-MING LI
國立中山大學 2009 微潤滑於超音波輔助切削之影響 李貫銘; Kuan-Ming Li

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