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| 國立成功大學 |
2007-08 |
Evaluations of the BGA solder ball shape by using energy method
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Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng |
| 國立成功大學 |
2006-04 |
An optimization analysis of UBM thicknesses and solder geometry on a wafer level chip scale package using robust methods
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Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng; Liang, Gin-Tiao |
| 國立成功大學 |
2005-01 |
Fatigue analysis of U-shaped flexural electro-thermal micro-actuators
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Kung, Chieh; Chen, Rong-Shen |
| 國立成功大學 |
2002-05 |
Analysis of the optimal dimension on the electrothermal microactuator
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Chen, Rong-Sheng; Kung, Chieh; Lee, Gwo-Bin |
| 國立成功大學 |
2000-05 |
Optimal dimension of PQFP by using Taguchi method
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Chen, Rong-Sheng; Lin, Heng-cheng; Kung, Chieh |
Showing items 1-5 of 5 (1 Page(s) Totally)
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