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| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
Showing items 1-3 of 3 (1 Page(s) Totally)
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