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Showing items 46-70 of 77  (4 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2018-09-10T03:24:09Z ARL4, an ARF-like protein that is developmentally regulated and localized to nuclei and nucleoli Lin, C.-Y.;Huang, P.-H.;Liao, W.-L.;Cheng, H.-J.;Huang, C.-F.;Kuo, J.-C.;Patton, W.A.;Massenburg, D.;Moss, J.;Lee, F.-J.S.; FANG-JEN LEE; PEI-HSIN HUANG
國立成功大學 2018 A new method for detection of single nucleotide polymorphism in a female reproduction-associated gene, tmigd1, of Anas platyrhynchos using a strip biosensor with gold nanoparticles Lin, C.-W.;Kuo, J.-C.;Liu, H.-L.;Cheng, Y.-S.;Huang, Huang H.-L.
國立成功大學 2017 Effect of prior deformation on microstructural development and Laves phase precipitation in high-chromium stainless steel Hsiao, Z.-W.;Chen, D.;Kuo, J.-C.;Lin, D.-Y.
國立交通大學 2014-12-08T15:19:47Z Effects of electromigration on grain rotation behavior of SnAg solders Lin, Han-wen; Chen, Chih; Kuo, J. C.; Chen, C. C.
國立成功大學 2014-07 EBSD investigation on microstructure transformation in low carbon steel during continuous cooling Su, B.; Lin, H-P.; Kuo, J-C.; Pan, Y-T.
國立成功大學 2014-04 Effect of pre-oxidation on increasing resistance of Fe-Al-Ni-Cr-Co-Mn high entropy alloys to molten Al attack Yang, H. H.; Tsai, W. T.; Kuo, J. C.
國立成功大學 2013-10-01 Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process Ho, C. E.; Liao, C. W.; Pan, C. X.; Chen, H. J.; Kuo, J. C.; Chen, D.
國立成功大學 2013 Accelerated Recrystallization in Electrodeposited Dual-Layer Copper Thin Films Alshwawreh, N.; Militzer, M.; Bizzotto, D.; Kuo, J. C.
臺大學術典藏 2013 A passive inertial switch using MWCNT-hydrogel composite with wireless interrogation capability Kuo, J.-C.; Kuo, P.-H.; Lai, Y.-T.; Ma, C.-W.; Lu, S.-S.; Yang, Y.-J.J.; YAO-JOE YANG
國立成功大學 2012-07 Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films Alshwawreh, N.; Militzer, M.; Bizzotto, D.; Kuo, J. C.
臺大學術典藏 2012 A hydrogel-based implantable wireless CMOS glucose sensor SoC Kuo, P.-H.; Lu, S.-S.; Kuo, J.-C.; Yang, Y.-J.; Wang, T.; Ho, Y.-L.; Chen, M.-F.; YAO-JOE YANG
臺大學術典藏 2012 A passive hydrogel-based inertial switch integrated with micromachined L-C resonator Kuo, J.-C.; Yang, Y.-J.; YAO-JOE YANG
國立高雄大學 2011-09 Application of the Digital Image Correlation Method to Micro Hole Drilling 童士恒; Shih, M.H.; Kuo, J.C.
國立高雄大學 2009-09 Evaluation of the Joint Roughness Coefficient using the Digital Image Correlation Method 童士恒; Shih, M.H.; Kuo, J.C.
臺大學術典藏 2008-12-31T01:53:55Z Effect of grinding parameters on the reliability of alumina TuanWH; Kuo, J.C.; Tuan, W.H.; Tuan, W.H.; Kuo, J.C.
國立臺灣大學 2007 Hop Count Distance in Flooding-based Mobile Ad Hoc Networks with High Node Density Kuo, J.-C.; Liao, W.
國立高雄大學 2006-11 On anisotropy of indentation induced piling-up by using optical microstrain measurement Lu, Y.Y.; Kuo, J.C.; 童士恒; Shih, M.H.
國立高雄大學 2006-11 On The Influence of Friction Using Simulation and Experiment Approach Liao, Y.Y.; Hsueh, C.T.; Kuo, J.C.; 童士恒; Shih, M.H.
國立臺灣大學 2006 The tumor suppressor DAPK inhibits cell motility by blocking the integrin-mediated polarity pathway Kuo, J. C.; Wang, W. J.; Yao, C. C.; Wu, P. R.; Chen, R. H.
臺大學術典藏 2006 The tumor suppressor DAPK inhibits cell motility by blocking the integrin-mediated polarity pathway Chen R.-H.; Wu P.-R.; JANE CHUNG-CHEN YAO; Wang W.-J.; Kuo J.-C.; Kuo J.-C.;Wang W.-J.;Jane Chung-Chen Yao;Wu P.-R.;Chen R.-H.
中國文化大學 2005 Solid-liquid equilibria for binary mixtures of N-phenylacetamide with 4-aminoacetophenone, 3-hydroxyacetophenone and 4-hydroxyacetophenone Chen, Y.P.; Tang, M; Kuo, J.C.
大葉大學 2003-11 Win-Win Industrial-Academic Cooperation: Development of Closed Aluminum Porous Material Applications Ma, Wei-Ping;Tzeng, Sheng-Chung;Kuo, J.C.
國立成功大學 2002-05 Real-time NURBS command generators for CNC servo controllers Cheng, Ming-Yang; Tsai, Meng-Chung; Kuo, J. C.
國立臺灣大學 2002 DAP-kinase induces apoptosis by suppressing integrin activity and disrupting matrix survival signals Wang, W.J.; Kuo, J.C.; Yao, C.C.; Chen, R.H.
國立臺灣大學 1999 Contribution of residual stress to the strength of abrasive ground alumina Tuan, W. H.; Kuo, J. C.

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