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"kuo shih ming"
Showing items 11-20 of 20 (1 Page(s) Totally)
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| 國立成功大學 |
2012-08-06 |
磁場對水熱法成長氧化鋅奈米柱之結構和光學特性研究
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郭士銘; Kuo, Shih-Ming |
| 國立成功大學 |
2009-12 |
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
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Mittal, Jagjiwan; Kuo, Shih-Ming; Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2009-07-15 |
Recrystallization under electromigration of a solder alloy
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2009-05-11 |
共晶錫-鋅無鉛銲錫接點之電遷移研究
|
郭世明; Kuo, Shih-Ming |
| 國立成功大學 |
2009-05-11 |
共晶錫-鋅無鉛銲錫接點之電遷移研究
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郭世明; Kuo, Shih-Ming |
| 國立成功大學 |
2008-10 |
Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2008-04 |
Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2007-10 |
The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2007-05 |
Microstructure evolution during electromigration between Sn-9Zn solder and Cu
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立高雄應用科技大學 |
2006 |
微型衝剪加工條件對剪斷面品質之影響
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郭士銘; Kuo, Shih Ming |
Showing items 11-20 of 20 (1 Page(s) Totally)
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