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Taiwan Academic Institutional Repository >
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"kuo shu chiao"
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| 國立交通大學 |
2018-08-21T05:56:59Z |
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
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Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:21Z |
A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration
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Lee, Shih-Wei; Kuo, Shu-Chiao; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:25Z |
Electrical Testing Structure for Stacking Error Measurement in 3D Integration
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Lee, Shih-Wei; Kuo, Shu-Chiao; Chen, Kuan-Neng |
| 國立交通大學 |
2015-11-26T00:55:52Z |
三維積體電路之低溫銅與銅接合結構設計及可靠度研究
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郭書喬; Kuo, Shu-Chiao; 陳冠能 |
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