臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| Total items :2826576
	Visitors : 31998253 Online Users : 1063 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library

Scope

Adv. Search

Login

Administrator

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"kwang lung"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 21-34 of 34 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
國立成功大學	2018-07	Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn-25Sn-xTi	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2018-04	Crystal Structure Variations of Sn Nanoparticles upon Heating	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2018-03-21	Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing	Lin;Chen-Yi;Chiu;Tsung-Chieh;Lin;Kwang-Lung
國立成功大學	2018	Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental study	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2018	Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG) Addition	Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lin;Kwang-Lung
國立成功大學	2017-10-25	Non-deformation recrystallization of metal with electric current stressing	Liang;PinChu;Lin;Kwang-Lung
國立成功大學	2017-10	The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-08-31	The mechanism of an increase in electrical resistance in Al thin film induced by current stressing	Liang;Chien-Lung;Lee;Ssu-Wei;Lin;Kwang-Lung
國立成功大學	2017-07-25	Current induced rapid phase transformation in Au/Sn reaction couple	Chiu;Tsung-Chieh;Lin;Kwang-Lung
國立成功大學	2017-06-15	Effect of Au/Pd bilayer metallization on solder/Cu interfacial reaction and growth kinetics of Cu-Sn intermetallic compounds during solid-state aging	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-06	Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps	Chen;Chiao-Wen;Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lee;Chiu-Wen;Lin;Kwang-Lung
國立成功大學	2017-01	Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2017-01	Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate	Niu;Xi;Lin;Kwang-Lung
國立成功大學	2017	Fundamentals of Solder Alloys in 3D Packaging	Lin;Kwang-Lung

Showing items 21-34 of 34 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page