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機構	日期	題名	作者
國立成功大學	2020-	Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學	2019-09-23	Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders	Lin;Jeng-Chi;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-07	The microstructure and shear behavior of Zn-25Sn-xTi solder joints with Ni substrate	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2019-06-15	Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-03-18	The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x=0-1.0 wt%) high temperature Pb-free solders	Guo;Wei-Ting;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-02-1	Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-01	High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2018-11	The microstructure and property variations of metals induced by electric current treatment: A review	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2018-10	The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2018-09	The interfacial bilayer Cu6Sn5 formed in a Sn-Ag-Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2018-07	Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn-25Sn-xTi	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2018-04	Crystal Structure Variations of Sn Nanoparticles upon Heating	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2018-03-21	Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing	Lin;Chen-Yi;Chiu;Tsung-Chieh;Lin;Kwang-Lung
國立成功大學	2018	Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental study	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2018	Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG) Addition	Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lin;Kwang-Lung
國立成功大學	2017-10-25	Non-deformation recrystallization of metal with electric current stressing	Liang;PinChu;Lin;Kwang-Lung
國立成功大學	2017-10	The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-08-31	The mechanism of an increase in electrical resistance in Al thin film induced by current stressing	Liang;Chien-Lung;Lee;Ssu-Wei;Lin;Kwang-Lung
國立成功大學	2017-07-25	Current induced rapid phase transformation in Au/Sn reaction couple	Chiu;Tsung-Chieh;Lin;Kwang-Lung
國立成功大學	2017-06-15	Effect of Au/Pd bilayer metallization on solder/Cu interfacial reaction and growth kinetics of Cu-Sn intermetallic compounds during solid-state aging	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-06	Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps	Chen;Chiao-Wen;Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lee;Chiu-Wen;Lin;Kwang-Lung
國立成功大學	2017-01	Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2017-01	Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate	Niu;Xi;Lin;Kwang-Lung
國立成功大學	2017	Fundamentals of Solder Alloys in 3D Packaging	Lin;Kwang-Lung

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	English \| 正體中文 \| 简体中文 \| 總筆數 :2826152
	造訪人次 : 31806908 線上人數 : 1030 教育部委託研究計畫計畫執行:國立臺灣大學圖書館