臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 11-20 of 36 (4 Page(s) Totally)
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Institution	Date	Title	Author
國立成功大學	2020-11	A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property	Liao;Yi-Han;Chen;Chang-Hsien;Liang;Chien-Lung;Lin;Kwang-Lung;Wu;Albert, T.
國立成功大學	2020-01-20	Electro-work hardening of metals induced by the athermal electromigration effect	Shu;Chih-Chi;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2020-	Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學	2019-09-23	Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders	Lin;Jeng-Chi;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-07	The microstructure and shear behavior of Zn-25Sn-xTi solder joints with Ni substrate	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2019-06-15	Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-03-18	The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x=0-1.0 wt%) high temperature Pb-free solders	Guo;Wei-Ting;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-02-1	Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-01	High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2018-11	The microstructure and property variations of metals induced by electric current treatment: A review	Liang;Chien-Lung;Lin;Kwang-Lung

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