臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2018-10	The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration	Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2018-09	The interfacial bilayer Cu6Sn5 formed in a Sn-Ag-Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2018-07	Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn-25Sn-xTi	Chang;Che-Wei;Lin;Kwang-Lung
國立成功大學	2018-04	Crystal Structure Variations of Sn Nanoparticles upon Heating	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2018-03-21	Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing	Lin;Chen-Yi;Chiu;Tsung-Chieh;Lin;Kwang-Lung
國立成功大學	2018	Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental study	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2018	Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG) Addition	Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lin;Kwang-Lung
國立成功大學	2017-10-25	Non-deformation recrystallization of metal with electric current stressing	Liang;PinChu;Lin;Kwang-Lung
國立成功大學	2017-10	The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-08-31	The mechanism of an increase in electrical resistance in Al thin film induced by current stressing	Liang;Chien-Lung;Lee;Ssu-Wei;Lin;Kwang-Lung

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